ES650 Automated Probing System
가격 문의
A 2-pin probing solution for HBM, MM, TLP, HMM, CC-TLP, LI-CCDM, RP-CCDM, CDM(JS-002) on package level, wafer level, and board level devices
Introduction
The Model ES650 automated probing system is a 2-pin probing solution for HBM, MM, TLP, HMM, CC-TLP, LI-CCDM, RP-CCDM, CDM(JS-002) on package level, wafer level, and board level devices. In addition to ESD testing solutions, the Model ES650 can be used solely for its robotic probing capabilities to precisely automate many probing applications for RF measurements, I-V curve tracing, and many other applications where precise probing is required. The probing system operates using two independently controlled (left & right) XYZ gantry with probes for contacting pins or pads on the chips or wafer. It has less parasitic compared with relay-based solutions without the need for socket PCB. Furthermore, the system support also multiple device testing, with mid-test failure checking and stop criteria for automated classification of multiple devices.
The HBM pulse module provides reliable pulsing up to 8kV with the ability to internally switch the probe connection to an SMU for leakage measurement allowing for device stressing and failure testing all in one solution. The pulse module can also internally swap the left and right probe connections to avoid needing to cross the probes during automated testing.
In addition to the HBM pulse module, the ES650 is available with modules that offer solutions for other pulsed testing such as MM and HMM as well CDM type solutions such as FICDM, LI-CCDM, CC-TLP, and RP-CCDM, a patent-pending contact first relay based CDM method. The system is also able to provide robotic probing for other testing methods such as TLP, EOS, RF probing, and many others.
Features
- High resolution cameras on each probe arm allows for easy pin alignment
- High resolution motion control system (down to 1 µm step)
- Batch Device Testing
- Leakage Sweep
- Automatic Collision Avoidance
- Probe contact can be captured by camera during test
- Customizable dimensions fit all types of device test requirement
- Current Probe is mounted close to DUT
- Device Definition Utility
- HBM Test Generator
- Data Analysis
Applications
- Fully automated 2 pin probing system
- Support many popular ESD standards and methods :
- - ANSI/ESDA/JEDEC JS-001-2017 (HBM)
- - ANSI/ESDA STM5.2 (MM)
- - ANSI/ESDA SP5.6 (HMM)
- - ANSI/ESDA STM5.5.1 (TLP)
- - ANSI/ESDA/JEDEC JS-002 (FICDM)
- - CC-TLP (ESDA SP pending, VF-TLP required)
- - ANSI/ESD SP5.3.3 (LI-CCDM, VF-TLP required)
- - Patent pending RP-CCDM method
- - Customized solutions available upon request
Specifications
우체국택배
반품 배송비(편도)2,500원
교환 배송비(왕복)5,000원
반품/교환 주소지(18478) 경기도 화성시 동탄역로 160 롯데백화점 동탄점 B3, 120호(KAIST-화성시 사이언스 허브 KAIST 동탄캠퍼스)
반품/교환 신청 기준일상품 수령 후 7일 이내 (단, 제품이 표시광고 내용과 다르거나 불량 등 계약과 다르게 이행된 경우는 제품 수령일로부터 3개월이내나 그 사실을 안 날 또는 알 수 있었던 날부터 30일 이내 교환/반품이 가능)
반품/교환 불가능 사유1. 소비자의 잘못으로 물건이 멸실되거나 훼손된 경우(단, 내용물을 확인하기 위해 포장을 훼손한 경우는 제외)
2. 소비자가 사용해서 물건의 가치가 뚜렷하게 떨어진 경우
3. 시간이 지나 다시 판매하기 곤란할 정도로 물건의 가치가 뚜렷하게 떨어진 경우
4. 복제가 가능한 물건의 포장을 훼손한 경우 (CD, DVD, GAME, 도서 등)
5. 용역 또는 문화산업진흥 기본법 제2조제5호의 디지털콘텐츠의 제공이 게시된 경우 (단, 가분적 용역 또는 가분적 디지털콘텐츠로 구성된 계약의 경우 제공이 개시되지 않은 부분은 제외)
6. 소비자의 주문에 따라 개별적으로 생산되는 상품이 제작에 들어간 경우